CHINAPLAS 2017


CHINAPLAS, recognized as the biggest plastics and rubber exhibition in Asia and the second in the world by plastic industry, will hold its 31th edition in 2017. CHINAPLAS 2017 rotates back to China Import & Export Fair Complex, Pazhou, Guangzhou, PR China on 16-19 May. With the theme of “Green Innovation for a Smart Future”, CHINAPLAS proposes a series of comprehensive applications for senior-level, professional visitors which especially focusing on “Intelligent Manufacturing”, “High-tech Materials” and “Green Solutions”.

This year at CHINAPLAS 2017, Moldex3D will demonstrate our latest CAE simulation technologies and showcase current and future industry trends. We cordially invite you to stop by our Booth (Hall 5.2 J41) and find out the best solution for helping you excel in today’s competitive global climate.

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Venue

China Import & Export Fair Complex, Pazhou, Guangzhou, PR China

IF

Contact

Anita Chen
anitachen@moldex3d.com
+886-3-5600199 ext. 703


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