Compression Molding Simulation Technology Roadmap Seminar

  • Date:Sep 10, 2013
  • Location: Novi, MI, USA

Compression Molding Simulation Technology Roadmap Seminar is a free 1/2-day technical seminar and will be held on Tuesday, September 10, 12:00 pm – 6:30 pm, a day before the 13th SPE Automotive Composites Conference & Exhibition (ACCE) for your convenience. This event will focus on the process control, material processing and simulation technology of compression moldings for both thermosets and thermoplastics. There will be in-depth presentations from academia and industry on product development, processing of charge, validation of fiber orientation, process control and validation. Industrial experts are invited and highly welcomed to facilitate the discussion in the seminar.

 Agenda

Time Session  Speaker
11:45 am – 12:45 pm Registration and lunch
12:45 pm – 01:00 pm Opening Remarks  Dr. Anthony Yang
CTO of Moldex3D
01:00 pm – 01:45 pm Compression moldings with LFT Prof. Tim Ossswald
University of Wisconsin Chemical Engineering
01:45 pm – 02:30 pm

Differences between Injection and Compression Molding of Short Fiber Composites

Prof. Byron Pipes
Purdue University Aero Engineering
02:30 pm – 02:45 pm Refreshment Break  
02:45 pm – 03:30 pm Effect of molding parameter on the warpage and fiber orientation for compression molded part   Dr. Yuyang
Toyota Technical Center
03:30 pm – 04:15 pm Structural Modeling of Long Fiber Thermoplastics and Discontinous Long Fiber Composites Mr. Kurt Danielson e-Xstream Engineering
04:15 pm – 05:15 pm CAE & Simulation Advances in Compression Molding  Dr. Anthony Yang
CTO of Moldex3D
05:15 pm – 05:30 pm Discussion, Q&A, wrap-up
05:30 pm – 06:30 pm Cocktail Reception

Location

Crowne Plaza Hotel- Detroit/Novi
27000 Karevich Dr.
Novi, Mi 48377

Contact

Ms. Chelsea Sink
chelseasink@moldex3d.com
Tel: +1 248-946-4570 ext 101


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