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2:00 PM EST | Wednesday, February 11, 2026 | Check Your Time

As electronic devices grow smaller, faster, and more complex, the demands placed on IC packaging processes have never been higher. Potting, dispensing, underfill, and dotting steps—not long ago considered routine—now directly influence electrical performance, thermal reliability, long-term durability, and customer confidence. Yet, even minor variations in material behavior or process conditions can lead to costly defects: voiding, uneven flow, overflow, trapped air, incomplete coverage, or unintended stress on delicate structures.

In this webinar, we take a deep dive into how simulation-driven validation empowers engineers and process teams to anticipate challenges long before material touches silicon. This session puts the spotlight on real manufacturing applications, showing how simulation helps evaluate flow behavior, predict failure modes, validate design strategies, and reduce development cycles across advanced packaging steps.

What Attendees Will Learn?

• How leading manufacturers approach potting, dispensing, underfill, and dotting for IC packages.
• How simulation helps validate process decisions before production.
• Insights into flow-induced defects—and how to prevent them.

SPEAKER INTRO

Srikar Vallury | Senior Director of Operations Srikar is the Senior Director of Operations at Moldex3D. He graduated with a master’s degree in mechanical engineering from Oregon State University and then moved to Michigan for his first job in the automotive industry. In 2013, Vallury made the transition to the plastics side when he joined Moldex3D and immediately fell in love with his job. As an engineer, he spends his time helping designers/engineers visualize and resolve their design or manufacturing issues through simulations. Being a strong advocate of simulation, Vallury focuses his efforts on ensuring the software application meets the expectations of the industry/user community.