Webinar: Designing Reliable Electronics Components through Injection Gate Optimization: Micromechanics-based, Process-Informed Structural Simulation

in Webinar on 03/09/2026
  • Date:Jun 17, 2026
  • Location: Americas
  • Time: 2:00 PM EDT

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2:00 PM EDT | Wednesday, June 17, 2026 | Check Your Time

Join us for a webinar on “Designing Reliable Electronics Components through Injection Gate Optimization.” In this session, we will explore how the placement of gates during injection molding affects fiber orientation and weld-line formation, and how these microstructural features can create regions prone to failure, all analyzed within Digimat.

Using micromechanics-based, process-informed simulations, Digimat allows engineers to evaluate different gate positions, predict fiber and weld-line patterns, and identify potential weak points in the part. By understanding these relationships, gate placement can be optimized to enhance part reliability, consistency, and overall manufacturing quality.

This session is ideal for engineers, designers, and manufacturing specialists seeking actionable insights into process-driven design decisions. You’ll see how Digimat’s coupled workflow bridges the gap between manufacturing, material microstructure, and potential failure assessment in electronics components.

What Attendees Will Learn?

  • Understand how gate location influences fiber orientation and weld-line formation in electronics components.
  • Learn how Digimat’s micromechanics-based, process-informed simulations can predict regions with higher potential for failure.
  • Use simulation insights to optimize gate placement for improved part reliability and structural performance.

SPEAKER INTRO

 

Gourab Ghosh | Hexagon

Dr. Gourab Ghosh is a Technical Specialist in the Material Center of Excellence of Manufacturing Intelligence Division of Hexagon in Novi, Michigan, USA. Gourab has over twelve years of experience in research, analysis, and teaching of finite element analysis of composite structures, material modeling, computational mechanics, and structural health monitoring. He has expertise in damage mechanics and crack modeling, composite material modeling, nonlinear finite element analysis of structures, additive manufacturing of short fiber reinforced polymer parts, and reverse engineering to compute material properties. Dr. Ghosh has worked on multiple research projects sponsored by the US Office of Naval Research, the National Science Foundation, the Boeing Company, to name a few.

Attendance Rewards:

Note:

  1. A minimum attendance of 30 minutes per session is required.
  2. This offer is exclusively available at our Michigan, USA office. Moldex3D does not cover travel expenses.
  3. Only residents of North or South America are eligible for the free participation in Moldex3D Analyst Certification and Moldex3D 3 Day Training.
  4. The attendance reward applies to individuals who meet the webinar participation criteria.
Registration
SF_2026_EST_Webinar_0617_Designing Reliable Electronics Components through Injection Gate Optimization: Micromechanics-based, Process-Informed Structural Simulation

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