- Date：Jul 31, 2026
- Location： Online
- Time： 11:30 AM IST
| Date | Time | |
| July 31, 2026 | 11:30 AM IST | Register |
🚀 Predict Before You Produce: Electronic Potting Simulation Using Moldex3D: Electronic potting is widely used to protect PCBs and electronic assemblies from moisture, dust, vibration, and harsh operating environments. However, achieving complete encapsulation without air traps, voids, or incomplete filling can be challenging.
How can engineers validate and optimize the potting process before production? Join this webinar to discover how Moldex3D ePotting enables virtual simulation of resin flow, filling behaviour, and potential defects—helping you improve product reliability while reducing costly trial-and-error.
🧠What You’ll Learn
- Fundamentals of Electronic Potting & Encapsulation
- Simulation of Resin Flow and Filling Behaviour
- Prediction of Air Traps, Voids & Incomplete Filling
- Evaluation of Dispensing Strategy and Process Parameters
- Process Optimization Through Virtual Validation
- Best Practices with a Real-World Moldex3D ePotting Case Study
🧠Who Should Attend?
- Electronics & PCB Design Engineers
- CAE Engineers
- Process & Manufacturing Engineers
- Product Development & R&D Engineers
- Product Reliability & Quality Engineers
- Electronic Potting & Encapsulation Professionals
⚙️Why Attend?
✔ Predict potential defects before production
✔ Reduce trial-and-error and development cost
✔ Improve encapsulation quality and product reliability
✔ Optimize dispensing process and manufacturing efficiency
✔ Accelerate product development with simulation-driven engineering
Contact
For sales & technical inquiries, please write to Khaled EL Bchiri at khaled.bchiri@moldex3d.com