- Date：Jul 19, 2012
- Location： Tokyo, Japan
Moldex3D sincerely invites you to join Siemens PLM Connection Japan 2012, and meet our experts for the professional molding solutions.
On July 19th, Moldex3D team will be exhibiting at六本木アカデミーヒルズ49, and presenting our advanced technology, which helps customers troubleshoot from product design to development, optimize design patterns, shorten time-to-market, and maximize product return on investment.
Moldex3D Featured Product: Moldex3D eDesignSYNC for NX
Moldex3D and Siemens jointly provide an integrated solution from NX CAD design to true 3D simulation, enhancing the product quality, shortening the cycle time, generate profit and creating global competence. Moldex3D eDesignSYNC can streamline your design process by predicting potential design blemishes and verify design changes in the early design phase under real world conditions. Designers can now create NX CAD models, setup the pre-processing conditions, and directly run professional injection molding analyses for design verification and optimization in their familiar NX environments.
Venue
Academy Hills 49F,
6-10-1 Roppongi, Roppongi Hills Mori Tower, Minato-ku, Tokyo
Contact
Sean Wang
Regional Manager
seanwang@moldex3d.com