Workshop Achievements
- Understanding 3D packaging simulation
- Capability to diagnose common challenges and solutions in 3D packaging
- Understanding basic concepts of compression molding
Agenda
| Time |
Session |
| 09:10 – 10:30 |
Design and Application Trend of 3D Package Stacking Technology |
| 10:40 – 12:00 |
First-Hand Experiences at Moldex3D Compression Molding |
Instructor
| |
Background and Experiences |
 Goran Liu |
- Education： Master in Mechanical Engineering, National Cheng-Kung University
- Specialties： IC thermal stress analysis, IC encapsulation analysis, Injection molding analysis, Fluid-structure interactions analysis
- Experiences：Mr. Liu is in charge of the integration of CAD and pre-procession software (Hyper Mesh、ANSA), and the applications of structural analysis software (ANSYS, ABAQUS, LS-DYNA…etc). He also serves as a lecturer and professional industry consultant for many well-known companies, including TriQuint semiconductor, Powertech, Samsung Semiconductor, UTAC, SPIL, Ford, YUDO, Foxconn Technology Group, Molex, Fujitsu, KYMC, DEPO Auto Parts, DSM, Tong Yang Corporation, Lite-On Technology , Far Eastern New Century Corporation, Formosa Taffeta, etc.
|
Location
S477 Located at Block S , level 4
Nanyang Polytechnic, 180 Ang Mo Kio Avenue 8, Singapore 569830
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