• Date：Jun 18, 2014 - Jun 19, 2014
• Location： Erie, PA, USA

• Date(s): Jun 18 2014 to Jun 19 2014

• Location: Burke Center (Directions)

Moldex3D is proud to be a Gold Level sponsor at the Injection Molding Innovation and Emerging Technologies Conference. The Behrend College at Penn State Erie, is once again hosting this highly successful conference. Come learn from industry experts. There will be half-hour presentations in the mornings, with three concurrent sessions on injection molding technology, materials technology, and executive/management practices.

A presentation on conformal cooling will be given by one of Moldex3D’s engineering experts at 9:15 am. The afternoons will feature a choice of three-hour tutorials, with many including a hands-on component. A networking session will be held after the tutorials on June 18th and will feature a pig roast.

Moldex3D Speaking Session

When: Wednesday, June 18, 2014
Topic: Enhancing Product Quality via Conformal Cooling Design
Presenter: John Snawerdt, Moldex3D