• Date：Jun 02, 2026
• Location： Livermore, CA, USA

Join a focused, small-group forum co-organized by Moldex3D and LS-DYNA & Ansys, taking place June 2, 2026, in Livermore, focused on eliminating voids, controlling fillet and overflow, and reducing warpage through simulation-driven insight.

Semiconductor packaging teams are under increasing pressure to deliver smaller, faster, and more reliable devices across both traditional transfer molding and advanced processes such as underfill, potting, and encapsulation. This pressure is further intensified by emerging architectures such as HBM, chiplet-based designs, and AI-focused applications.

Critical issues including void formation in underfill and encapsulation, fillet control, overflow, wire sweep, and package warpage are often discovered late in development. These late-stage discoveries lead to costly design iterations, qualification delays, and increased reliability risk.

This one-day, in-person forum brings together industry experts to explore how these challenges can be addressed earlier through simulation-driven approaches.

Co-hosted by Moldex3D and LS-DYNA & Ansys, the sessions will demonstrate how combining process simulation with structural and multiphysics analysis provides deeper visibility into encapsulation behavior, stress development, and long-term package reliability before tooling and production begin.

Through real-world case studies and technical discussion, attendees will learn how simulation can be used to predict and reduce voids, fillet inconsistencies, overflow, and wire sweep in underfill, potting, encapsulation, and transfer molding processes. The forum will also cover methods for understanding and mitigating warpage and residual stress to improve package integrity and yield while reducing design iterations and qualification cycles to accelerate development timelines and lower overall cost.

This is a focused, small-group event designed for practical learning and open discussion with peers facing similar challenges.

Complimentary lunch will be provided.

Agenda

Coming Soon

Venue

LS-DYNA
7374 Las Positas Road, Livermore, CA 94551

Contact

Srikar Vallury
E: sales.us@moldex3d.com
P: 248-946-4570