MOLDEX-3D

Date	Event Name	Location	Event Type
May 20, 2026	Molding Innovation Day 2026 – University of Massachusetts Lowell	Lowell, MA, USA	Conferences/ Seminars
May 26, 2026	Molding Innovation Day – Italy 2026	Lazise, Italy	Conferences/ Seminars
Jun 02, 2026	Semiconductor Packaging Forum: Solving Today’s Process & Reliability Challenges	San Jose, CA, USA	Conferences/ Seminars
Aug 26, 2026	Molding Innovation Day 2026 – University of Tennessee	Knoxville, TN, USA	Conferences/ Seminars
Sep 29, 2026	Molding Innovation Day 2026 – Chicago	Chicago, IL, USA	Conferences/ Seminars

• • Date
  • Event Name
  • Location
  • Event Type
• • Date: May 20, 2026
  • Event Name: Molding Innovation Day 2026 – University of Massachusetts Lowell
  • Location: Lowell, MA, USA
  • Event Type: Conferences/ Seminars
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• • Date: May 26, 2026
  • Event Name: Molding Innovation Day – Italy 2026
  • Location: Lazise, Italy
  • Event Type: Conferences/ Seminars
  • LEARN MORE
• • Date: Jun 02, 2026
  • Event Name: Semiconductor Packaging Forum: Solving Today’s Process & Reliability Challenges
  • Location: San Jose, CA, USA
  • Event Type: Conferences/ Seminars
  • LEARN MORE
• • Date: Aug 26, 2026
  • Event Name: Molding Innovation Day 2026 – University of Tennessee
  • Location: Knoxville, TN, USA
  • Event Type: Conferences/ Seminars
  • LEARN MORE
• • Date: Sep 29, 2026
  • Event Name: Molding Innovation Day 2026 – Chicago
  • Location: Chicago, IL, USA
  • Event Type: Conferences/ Seminars
  • LEARN MORE