- Date：Mar 26, 2025
- Location： Erie, PA, USA
Moldex3D, Anova, and Penn State Behrend College are excited to co-host the Molding Innovation Day on March 26th, 2025. This seminar will be dedicated to exploring the cutting-edge advancements in simulation solutions, specifically tailored to tackle prevalent challenges in injection molding. To enrich the experience, a half-day hands-on workshop will be conducted, providing participants with valuable insights and guidance led by Moldex3D experts.
Admission to this event comes at no cost, making it accessible to all interested individuals. Furthermore, attendees who are not currently using Moldex3D software will receive a complimentary 1-month trial license as an added bonus.
Agenda
| Time (EDT) | Session | Presenter |
| 8:30 AM – 9:00 AM | Arrival/Sign-In | |
| 9:00 AM – 9:05 AM | Introduction | Penn State |
| 9:05 AM – 9:35 AM | Simulation of Low Constant Pressure Molding Process with Sensor Feedback Pressure Control | Moldex3D |
| 9:35 AM – 10:05 AM | Electronics Over-molding Simulation and Prototype 3D Printed Mold | Kyocera AVX |
| 10:05 AM – 10:35 AM | A Study in Additive Conformal Cooling | Anova |
| 10:35 AM – 10:50 AM | Break | |
| 10:50 AM – 11:20 AM | Long glass vs. short glass fiber. Key differences and why to use | Chemigon |
| 11:20 AM – 11:50 AM | Moldex3D Warpage Analysis and Visualization Techniques | Moldex3D |
| 11:50 AM – 12:30 PM | Tour of the Facility | Penn State-Jason Williams, PLET Faculty |
| 12:30 PM – 01:30 PM | Lunch | |
| Hands-on Workshop | ||
| 1:30 PM – 2:45 PM | Quick Demo of Moldex3D Pre-Processing – CADDoctor – Meshing Best Practices – Advantages of Boundary Layer Meshing (BLM) |
Moldex3D |
| 2:45 PM – 3:00 PM | Break | |
| 3:00 PM – 4:30 PM | Project Setup – Best Practices – Standard Simulation Workflow – Result Interpretation – Studio Demo |
Moldex3D |
| 4:30 PM – | Q&A | Moldex3D |
Venue
Penn State Behrend College
4701 College Drive, Erie, PA 16563
Contact
Csilla Lovera
E: sales.us@moldex3d.com
P: 248-946-4570