10:00 AM CET / 2:30 PM IST | Wednesday, November 26, 2025 | Check Your Time

Registration Deadline: ONE DAY BEFORE THE WEBINAR.

Moldex3D has developed two key strategies — the Hybrid Model and the Equivalent Bump Group (EBG) Model — to enhance efficiency and accelerate Capillary Underfill (CUF) simulation. These methods not only ensure accuracy but also significantly reduce computation time.

In this webinar, the speaker will give a fundamental introduction to Hybrid CUF and Hybrid EBG CUF. Several practical simulation cases will be presented to help attendees gain a comprehensive understanding of their benefits. Finally, a step-by-step demonstration of Hybrid EBG CUF operation in Moldex3D will be provided.

What You Will Learn

• Introduction of Moldex3D Hybrid CUF
• Introduction of Moldex3D Hybrid EBG CUF
• How Hybrid CUF & Hybrid EBG CUF improve efficiency