• Date：May 16, 2025
• Location： Online
• Time： 11:30 AM IST

Description

Explore how intelligent simulation with Moldex3D transforms the electronic potting process by accurately predicting material flow, identifying potential defects, and enhancing overall efficiency. This session will walk you through real-world insights into how simulation-driven decisions can ensure reliable, defect-free encapsulation of PCBs—reducing costly trial-and-error iterations and improving product performance.

What You Will Learn

• Understanding Electronic Potting & Encapsulation
  – Why encapsulation is critical for electronic component durability
  – How potting safeguards PCBs against moisture, vibration, and environmental stress
• Common Challenges in Potting Processes
  – Typical issues such as air entrapment, void formation, and material shrinkage
  – The impact of these defects on product reliability and lifespan
• How Moldex3D Optimizes Potting Performance
  – Simulating complex material flow behavior and filling dynamics
  – Detecting defect-prone areas before physical trials
  – Fine-tuning process parameters for optimal results
• Case Study: Simulation in Action
  – Real-world application of Moldex3D in electronic potting
  – Valuable lessons from simulation-driven improvements
  – Key process recommendations to achieve consistent quality

Who Should Attend

• Electronics and PCB design engineers
• Process and manufacturing engineers
• R&D professionals and product reliability teams

By the end of this session, you’ll gain practical knowledge on how to leverage Moldex3D for smarter electronic potting processes—leading to reduced defects, improved product reliability, and faster time to market.

Contact

For sales & technical inquiries, please write to Khaled EL Bchiri at khaled.bchiri@moldex3d.com