- Date：Jul 16, 2026
- Location： Online
- Time： 1:30 PM IST
Note: Moldex3D reserves the right to cancel events in case of an insufficient number of participants.
| Date | Time | |
| July 16, 2026 | 1:30 PM IST | Register |
Description
Moldex3D is a scientific tooling of plastic injection molding. It can help users to check the potential injection problems before making mold. Therefore, customers can save time and money on trial mold and repaired product.
In today’s semiconductor packaging landscape, the transfer molding process plays a critical role in ensuring high-quality, reliable encapsulation of ICs (Integrated Circuits). Mastering the simulation workflow—from charge gating and mesh strategy to curing and warpage—enables engineers to anticipate defects like voids, warpage or wire sweep before the mold is built.
This focused online training is designed to take you through the full workflow of Moldex3D’s IC Packaging Transfer Molding module—covering preprocessing, analysis setup and post-processing.
Whether you’re just starting with Moldex3D or already experienced, this session will equip you with best practices and practical techniques to enhance your simulation accuracy, reduce iteration time and drive packaging quality improvement.
Agenda
| Time | Session | Presenter |
| 13:30-14:50 IST | Pre-processing
|
Pankaj Sharma |
| 14:50-15:00 IST | Break | |
| 15:00-15:30 IST | Analysis setup
|
Pankaj Sharma |
| 15:30-15:35 IST | Break | |
| 15:35-16:20 IST | Post Processing ( Result Interpretation )
|
|
| 16:20-16:30 IST | Q & A | Pankaj Sharma |
Contact
Khaled EL Bchiri
khaled.bchiri@moldex3d.com
Abhishek Tiwari
+91-98331-97831
abhishek.t@moldex3d.com