- Date：Dec 03, 2026
- Location： Online
- Time： 1:30 PM IST
Note: Moldex3D reserves the right to cancel events in case of an insufficient number of participants.
| Date | Time | |
| December 3, 2026 | 1:30 PM IST | Register |
Description
Moldex3D is a scientific tooling of plastic injection molding. It can help users to check the potential injection problems before making mold. Therefore, customers can save time and money on trial mold and repaired product.
In modern semiconductor packaging, potting and dispensing processes play an essential role in protecting integrated circuits from moisture, mechanical stress and harsh environments. Accurately simulating potting workflows—including material flow, creeping, air‐trap formation and final stress distribution—is critical for robust packaging design.
This hands-on online training session will take you through the entire simulation workflow for IC packaging potting using Moldex3D—covering preprocessing, simulation setup and result interpretation.
Whether you are just getting started or already familiar with IC packaging simulation, this course will provide you with industry best practices and insights to elevate your modeling and simulation outcomes.
Agenda
| Time | Session | Presenter |
| 13:30-14:50 IST | Pre-processing
|
Pankaj Sharma |
| 14:50-15:00 IST | Break | |
| 15:00-15:30 IST | Analysis setup
|
Pankaj Sharma |
| 15:30-15:35 IST | Break | |
| 15:35-16:20 IST | Post Processing ( Result Interpretation )
|
|
| 16:20-16:30 IST | Q & A | Pankaj Sharma |
Contact
Khaled EL Bchiri
khaled.bchiri@moldex3d.com
Abhishek Tiwari
+91-98331-97831
abhishek.t@moldex3d.com