- Date：Sep 10, 2026
- Location： Online
- Time： 1:30 PM IST
Note: Moldex3D reserves the right to cancel events in case of an insufficient number of participants.
| Date | Time | |
| September 10, 2026 | 1:30 PM IST | Register |
Description
Moldex3D is a scientific tooling of plastic injection molding. It can help users to check the potential injection problems before making mold. Therefore, customers can save time and money on trial mold and repaired product.
In the evolving realm of semiconductor packaging, compression molding plays a pivotal role—particularly for advanced IC packages that demand high strength, precision, and reliability. Accurately simulating this process means mastering the full workflow: charge preparation, mold motion, curing, warpage, die shift and more.
This online training session is tailored to guide you through the entire simulation workflow for IC packaging compression molding using Moldex3D—from the preprocessing and mesh strategy, through process setup, to post-processing and result interpretation.
Whether you’re new to Moldex3D or already simulating IC packaging, this course will equip you with the industry best practices and expert insights to optimize your simulation workflow, reduce rework and deliver robust results.
Agenda
| Time | Session | Presenter |
| 13:30-14:50 IST | Pre-processing
|
Pankaj Sharma |
| 14:50-15:00 IST | Break | |
| 15:00-15:30 IST | Analysis setup
|
Pankaj Sharma |
| 15:30-15:35 IST | Break | |
| 15:35-16:20 IST | Post Processing ( Result Interpretation )
|
|
| 16:20-16:30 IST | Q & A | Pankaj Sharma |
Contact
Khaled EL Bchiri
khaled.bchiri@moldex3d.com
Abhishek Tiwari
+91-98331-97831
abhishek.t@moldex3d.com