10:00 – 11:00 AM (GMT+8) | June 17 | Check Your Time

Welcome to our presentation on Cutting-Edge Simulation Methods for Predicting and Reducing Stress Marks on Product Surfaces using Moldex3D. Surface defects, like stress marks, often stem from uneven cooling during the molding process, impacting product quality and appearance. This session will showcase how advanced simulation tools can pinpoint hidden issues and provide actionable solutions to optimize cooling design. Learn how conformal cooling techniques eliminate hot spots, reduce residual stress, and enhance product aesthetics. Whether you’re a molding engineer, processing expert, tooling specialist, or part designer, this presentation will equip you with innovative strategies to improve efficiency and ensure flawless production outcomes.

What Attendees Will Learn?

• Identify the Root Cause of Surface Defects: Learn how poor cooling design impacts temperature distribution, leading to stress marks.
• Optimize Cooling with Conformal Cooling Solutions: Discover how conformal cooling eliminates hot spots and reduces residual stress near critical areas like gate regions.
• Leverage Moldex3D for Accurate Predictions: See how advanced simulations validate filling, packing, and cooling processes to prevent defects early.