Explore the Future of Smart Manufacturing at CHINAPLAS 2026 — Together with Moldex3D!
CHINAPLAS 2026 returns on April 21–24 at the National Exhibition and Convention Center in Shanghai, bringing together global leaders to showcase the next wave of innovation in plastics and rubber. As the industry moves toward higher complexity and sustainability, businesses face new challenges—and even greater opportunities.
Visit Moldex3D at 5.2K67, where we’ll show you how simulation can transform the way you develop products. Discover how smarter, earlier insights help you cut unnecessary trials, accelerate project timelines, and stay in control of quality and cost. With Moldex3D, you can make confident decisions from the very beginning, turning every development into a faster, smoother, and more efficient success.
We can’t wait to meet you at CHINAPLAS—let’s create the next chapter of smart manufacturing together.
Highlights of Moldex3D 2026 New Features
Digital Twin
Enhanced crystallization models and upgraded weldline algorithms help reflect real-world molding behavior.
Accessibility
A streamlined workflow—from modeling to result display—enables engineers a fast and efficient decision making.
A.O.I.
Seamlessly connect simulation, data management, and optimization through automation, DOE, and AI.
IC Packaging
New Hybrid technologies and refined encapsulation workflows significantly reduce computational effort.
Moldex3D Tech Forum
Booth No: 5.2 K67
Apr 21 (Tue.)
Apr 22 (Wed.)
Apr 23 (Thu.)
Apr 24 (Fri.)
Coming Soon
Coming Soon
Coming Soon
Coming Soon
Chinaplas 2026
Date
April 21-24
Opening Hours
9:30-17:30
Venue
National Exhibition and Convention Center, Shanghai