- Date：Apr 17, 2023 - Apr 20, 2023
- Location： Shenzhen, China
- Booth Number：Hall 7, 7Q27
- Official Website：https://www.chinaplasonline.com/CPS23/idx/eng/
As a leading provider of advanced simulation solutions for plastics and rubber industries, Moldex3D is honored to participate in CHINAPLAS 2023 as an exhibitor. CHINAPLAS, as one of the most influential exhibitions in the world and the world’s leading plastics and rubber trade fair, it is widely recognized by the industry as one of the most significant events in the industry. Its significance is surpassed only by K Fair in Germany, the world’s premier plastics and rubber trade fair. We are excited to showcase our cutting-edge technology and innovative solutions that can help our customers optimize their product design and manufacturing process, and ultimately achieve a sustainable and profitable growth. We cordially invite you to visit Moldex3D booth (7Q27) and discover how Moldex3D can help you stay ahead of the competition. Don’t miss this valuable opportunity to network with industry experts and explore the latest trends and developments in the plastics and rubber industries. We look forward to welcoming you at Moldex3D booth.
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Visitor Pre-registration
Pre-registration
Deadline for visitor pre-registration: April 11, 2023 17:00 (GMT+8:00)
Date
July 17 (Mon.) – July 20 (Thu.), 2023
9:30 AM-5:30 PM
Venue
Shenzhen World Exhibition & Convention Center
No.1 Zhancheng Road, Fuhai Street, Bao’an District, Shenzhen, Guangdong, PR China (Traffic Info)
Technical Forum
| 日期 | 时间 | 主题 | 讲师 |
| 4/17 | 10:15-10:45 | 新能源汽车纤维复合材料加工成型挑战问题解析之应用 | Jim |
| 11:00-11:20 | 双射注压应用及Moldex3D成型分析 | SABIC | |
| 11:30-12:00 | Moldex3D在液态硅胶产品热平衡设计问题与应用解析 | Cho | |
| 13:30-14:00 | Moldex3D在射出成型机数字双生虚实整合之应用 | Sawye | |
| 14:15-14:45 | 家电与消费性电子吸塑与热压成型制程开发与应用挑战 | Denny | |
| 15:30-16:00 | Moldex3D参数式仿真工具-帮助实现自动优化产品与模具设计 | Hardy | |
| 4/18 | 10:15-10:45 | 新能源汽车纤维复合材料加工成型挑战问题解析之应用 | Jim |
| 11:00-11:30 | 家电与消费性电子吸塑与热压成型制程开发与应用挑战 | Denny | |
| 11:45-12:15 | Moldex3D在液态硅胶产品热平衡设计问题与应用解析 | Cho | |
| 13:30-14:00 | Moldex3D在射出成型机数字双生虚实整合之应用 | Sawye | |
| 14:15-14:35 | 双射注压应用及Moldex3D成型分析 | SABIC | |
| 15:00-15:30 | Moldex3D参数式仿真工具-帮助实现自动优化产品与模具设计 | Hardy | |
| 4/19 | 10:15-10:35 | 双射注压应用及Moldex3D成型分析 | SABIC |
| 11:00-11:30 | 家电与消费性电子吸塑与热压成型制程开发与应用挑战 | Denny | |
| 11:45-12:15 | Moldex3D在液态硅胶产品热平衡设计问题与应用解析 | Cho | |
| 13:30-14:00 | Moldex3D在射出成型机数字双生虚实整合之应用 | Sawye | |
| 14:15-14:45 | 新能源汽车纤维复合材料加工成型挑战问题解析之应用 | Jim | |
| 15:00-15:30 | Moldex3D参数式仿真工具-帮助实现自动优化产品与模具设计 | Hardy | |
| 4/20 | 10:15-10:35 | 双射注压应用及Moldex3D成型分析 | SABIC |
| 11:00-11:30 | 家电与消费性电子吸塑与热压成型制程开发与应用挑战 | Denny | |
| 11:45-12:15 | Moldex3D在液态硅胶产品热平衡设计问题与应用解析 | Cho | |
| 13:30-14:00 | Moldex3D在射出成型机数字双生虚实整合之应用 | Sawye | |
| 14:15-14:45 | 新能源汽车纤维复合材料加工成型挑战问题解析之应用 | Jim | |
| 15:00-15:30 | Moldex3D参数式仿真工具-帮助实现自动优化产品与模具设计 | Hardy |
*The seminar will be conducted in Mandarin.
Contact
Anita Chen
anitachen@moldex3d.com
+886 3 5600199 #703
Kamin Li
kaminli@moldex3d.com
+86 769 2282 8570 #809