The Latest Moldex3D IC Packaging Simulation & Application

Date: 4/11, 4/18, 4/25
Time: 15 giờ phút sáng

With traditional transistor pitch scaling facing fundamental challenges, advanced package has been widely used as one of the effective enablers for “More-than-Moore” technology. Adopting advanced package enables technologies adopting is poised to help enabling the future 5G, HPC, AIOT device applications to integrate a variety of functional dies with different wafer nodes, wafer sizes, and so on – into one packaged unit. In order to help the audience realize the advantages of advanced package, speakers will provide a range of differentiated packaging enabling technologies, including key technology trends, process challenges, corresponding Methodology, Material, Simulation tool enabling solutions, and so on.

What you will learn:

• Advanced Package Market and Technology Trend
• Moldex3D IC Package Solution
• Simulation case study on Advanced Package

Contact

For sales & technical inquiries, please write to Victor Nguyen at victornguyen@moldex3d.com
For event & marketing inquiries, please write to Claire Yang at claireyang@moldex3d.com