• Date：May 02, 2017
• Location： Troy, MI, USA
• Official Website：https://www.eiseverywhere.com/ehome/197676/450736/?eb=330521

Moldex3D is delighted to announce that we will participate in SPE AUTO EPCON 2017, a 1-day technical conference & exhibition showcasing innovative developments in the design, materials, processing and use of engineering plastics for the global automotive industry. The event will take place in Detroit Marriott Troy; It is the conference that is specifically designed to inform, update and educate the OEM and supplier communities about advances in both thermoset and thermoplastic engineering polymers.

As an honored sponsor of this event, Moldex3D’s professional will be on-site and speak to the event’s professionals about our most up-to-date simulation solutions and how you can apply the latest technologies in the automotive industry. You may also check out our Automotive Applications page on our website to find out more about what Moldex3D can do for the industry.

If you are attending this event this year, please don’t forget to stop by our table and find out what Moldex3D can do to help you design better automotive plastic parts.

Moldex3D Speaking Session