- Date：Apr 16, 2025
- Location： Online
- Time： 11:30 AM IST
| Date | Time | |
| April 16, 2025 | 11:30 AM IST | Closed |
Description
Plastic Chip Encapsulation is a molding process where chips are capsulated with Epoxy Molding Compound (EMC) to prevent physical damage or corrosion. This process contains the interconnection between microchips and other electronics (so-called wire bonding), curing phenomenon of thermoset material, and various control management of process conditions. Due to the complexity of multiple material components, such as EMC, chip, or lead frame, and high wire density, many challenges and uncertainties have been brought to the Chip Encapsulation process. Common defects include incomplete fill, air traps, voids, wire sweep, paddle shift, package warpage, etc.
What You Will Learn
Moldex3D IC Packaging offers a complete set of molding solutions, covering processes like Transfer Molding, Molded Underfill, Capillary Underfill (CUF), Compression Molding, Embedded Wafer Level Package (EMWLP), and No Flow Underfill (NFU) / Non-Conductive Paste (NCP). Its automatic meshing feature makes encapsulation analysis easier, while advanced manual meshing is available for complex components like undercut-shaped lead frames.
With Moldex3D IC Packaging, designers can analyze the entire chip encapsulation process—from filling and curing to cooling and advanced manufacturing aspects like filler concentration, underfill encapsulation, post-molding curing, stress distribution, and structural evaluation. The software helps predict and resolve molding issues early, improving chip quality and preventing defects. Accurate simulations also support design optimization and cost management.
Contact
For sales & technical inquiries, please write to Khaled EL Bchiri at khaled.bchiri@moldex3d.com