- Date：Feb 24, 2025
- Location： Online
- Time： 11:30 AM IST
| Date | Time | |
| Feb. 24, 2025 | 11:30 AM IST |
Closed |
Description
Discover how Intelligent Electronic Potting Simulation with Moldex3D helps optimize PCB protection by predicting material flow, identifying defects, and enhancing process efficiency. Learn how Moldex3D simulation enable defect-free encapsulation through a real-world case study, reducing trial-and-error and improving reliability.
What You’ll Learn:
What is Electronic Potting & Encapsulation?
- Importance of encapsulation in electronic components
- How potting protects PCBs from environmental stress and failure
Challenges in Electronic Potting
- Common defects: air entrapment, voids, material shrinkage
- Process-related issues affecting performance
How Moldex3D’s E-Potting Module Helps
- Simulating material flow behavior and filling patterns
- Identifying potential defects before actual production
- Optimizing process parameters for better efficiency
Real-World Case Study
- Application of Moldex3D in an actual E-potting scenario
- Key insights gained from simulation results
- Recommendations for process improvement
By the end of this session, you will have a clear understanding of how simulation-driven optimization can enhance electronic potting processes, reduce manufacturing defects, and improve product reliability.
Contact
For sales & technical inquiries, please write to Khaled EL Bchiri at khaled.bchiri@moldex3d.com