- Date：Jul 02, 2024 - Jul 03, 2024
- Location： Hsinchu, Taiwan
In IC manufacturing, leveraging numerical simulation for predictive analysis is crucial for enhancing yield rates and success in advanced packaging technologies like 2.5D and 3D-IC configurations. The complex assembly and packaging processes involve various challenges, such as defects and warpage issues due to thermal and chemical shrinkage. Numerical simulation through CAE helps identify and address these challenges, improving process design and methodologies and ultimately leading to higher yield rates.
To keep up with the industry’s needs, Moldex3D offers IC Packaging solutions that help chip designers thoroughly analyze the chip encapsulation process from filling, curing, and cooling to advanced manufacturing demands, such as wire sweep, die shift, filler concentration, underfill encapsulation, post-molding curing, stress distribution, and structural evaluation. In addition to IC Packaging, Moldex3D’s product line — Electronic Potting, makes it possible to model the fluid dynamics during the potting process, effectively predicting the location and size of air traps. With Moldex3D IC Packaging and Electronic Potting simulation, significant molding problems can be predicted and solved in advance. Engineers can thus enhance the quality of the chip and efficiently prevent potential defects. Moreover, our accurate simulation helps optimize the design and reduce costs.
To further explore the applications of Moldex3D IC Packaging in the semiconductor industry, we are excited to announce the 2024 Moldex3D IC Packaging Technology International Conference. This event, scheduled on July 2nd in Tai Yuen Hi-Tech Industrial Park, Hsinchu, Taiwan, is a unique opportunity for you to join and listen to our esteemed speakers shedding light on the latest trends and technologies in advanced packaging and simulation solutions. If you’re interested, don’t hesitate to sign up for this event. We look forward to your participation at the 2024 Moldex3D IC Packaging Technology International Conference!
| Mass Production | Advanced IC packaging |
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Agenda
Day 1 – Tuesday, July 2, 2024
| Time | Topic | Presenter |
| 09:20-09:50 | Registration | |
| 09:50-10:00 | Opening | Moldex3D |
| 10:00-10:40 | Technologies for Heterogeneous Integration in the GAI Era | SiPlus |
| 10:40-11:20 | Numerical Modeling of Capillary Underfill in Direct Chip Attach Packages | Micron Semiconductor Asia Operations Singapore |
| 11:20-12:00 | Underfill Material for Narrow Gap PKG | Sanyu Rec Japan |
| 12:00-13:30 | Lunch | |
| 13:30-14:00 | Harnessing the Power of Simulation: Exploring Moldex3D’s Enhanced Numerical Tools in Advanced IC Packaging | Moldex3D |
| 14:00-14:30 | Modeling Fabrication Process of IC Packages | National Cheng Kung University |
| 14:30-15:00 | Encapsulation Reliability of EMC Phenomenon and Tool Prediction | ASE Taiwan |
| 15:00-15:30 | Coffee Break | |
| 15:30-16:00 | Deep Generative AI for IC Packaging | National Cheng Kung University |
| 16:00-16:30 | Advancing the Frontiers Molding Simulation with Accurate Material Properties | Moldex3D |
| 16:30 | Closing |
Day 2 – Wednesday, July 3, 2024
| Time | Topic | Location |
| 09:30-11:30 | Workshop of Semiconductor Materials Insight – Moldex3D Material Lab |
Moldex3D 8F Training Room |
| 11:30-12:30 | Lunch | |
| 12:30-14:30 | Visit TSMC Museum of Innovation | Hsinchu Science Park |
| 14:30-16:00 | Visit Science Park Exploration Museum | Hsinchu Science Park |
| 16:00 | Closing |
*This is a preliminary agenda. Sessions are subject to change.
Venue
Theater-style Conference Center of Tai Yuen Hi-Tech Industrial Park Phase I
2F., No. 26, Taiyuan St., Zhubei City, Hsinchu County 302, Taiwan
Recommended Accommodations
The following are recommended accommodations, please make your own reservation.
| Name of Hotels | Distance to Moldex3D HQ | Location |
| SHERATON Hsinchu Hotel (喜來登大飯店) | 15 mins by driving | Zhubei City |
| HOTEL BONZA (享豪大飯店) | 5 mins by driving or 15 mins on foot | Zhubei City |
| AJ HOTEL (新竹安捷國際酒店) | 30 mins by driving | Zhubei City |
| Chiao-Lotus HOTEL (喬蓮大飯店) | 5 mins on foot | Zhubei City |
| SHIN YUAN HOTEL (新苑庭園大飯店) | 20 mins by driving | Hsinchu City |
| Lakeshore HOTEL (煙波大飯店) | 20 mins by driving | Hsinchu City |
| Ambassador HOTEL (國賓大飯店) | 20 mins by driving | Hsinchu City |
Contact
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