Moldex3D Workshop 2019 – IC Packaging & Injection Molding

in Past Events on 07/29/2019
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  • Date：Sep 25, 2019 - Sep 26, 2019
  • Location： Country Inn & Suites by Radisson, San Jose, CA, USA

Moldex3D’s annual IC Packaging & Injection Molding Workshop will be held at the Country Inn & Suites by Radisson, San Jose, CA, from September 25-26, 2019. The goal of this workshop is to help industry professionals catch up on innovative advancements in the IC packaging industry and to feature simulation solutions you need to succeed in the microchip encapsulation molding process. Participants will also have the opportunity to experience the new simulation capabilities of Moldex3D R17 that can help them bridge the gap between simulation and manufacturing. Reserve your FREE seat today as spaces are limited and are assigned on a first-come basis. 

Register Now

 

 

Day 1 – IC Packaging Session
Wednesday, Sept. 25, 2019

This session, we will show how Moldex3D can help you predict, prevent, and avoid critical molding challenges related to IC packaging such as stress and warpage, improving chip quality and prevent potential defects more efficiently.

 

Day 2 – Injection Molding Session
Thursday, Sept. 26, 2019

Our professional experts will share their industry knowledge and how the latest version of Moldex3D R17 helps users optimize the overall simulation analysis process. There will also be a half-day hands-on workshop. ※ Any current non-users who attend the Day 2 workshop will receive a 30-day trial license to test-run our software.※ 

Agenda

Day 1 – IC Packaging Session | Wednesday, Sept. 25, 2019

Time Session
8:00 AM – 8:25 AM Breakfast/Registration
8:25 AM – 8:30 AM Introduction
8:30 AM – 9:00 AM New Features of Moldex3D IC Packaging in the Latest Version
9:00 AM – 9:30 AM SiP Module Moldability Experiment and Simulation Study
9:30 AM – 10:00 AM Void Study of Flip Chip Packages
10:00 AM – 10:15 AM Break
10:15 AM – 10:45 AM Latest Simulation Technology of Capillary Underfill Process
10:45 AM – 11:15 AM Demo of Moldex3D IC Automeshing Solution – Part 1
11:15 AM – 11:45 AM Demo of Moldex3D IC Automeshing Solution – Part 2
11:45 AM – 12:00 PM Q&A
12:00 PM – Lunch

Day 2 – Injection Molding Session | Thursday, Sept. 26, 2019

Time Session Company Speaker
8:30 AM – 8:55 AM Breakfast/Registration
8:55 AM – 9:00 AM Introduction Moldex3d NA Srikar Vallury 
9:00 AM – 9:30 AM Latest Trends of Mold Filling CAE Technology Moldex3D NA Srikar Vallury
9:30 AM – 10:00 AM Process Transfer with Moldex3D Simulation RJG Doug Espinoza
10:00 AM – 10:30 AM Predicting and Improving Part Warpage Through Simulation Moldex3D NA Jay Vang
10:30 AM – 10:45 AM Break
10:45 AM – 11:15 AM A Robust, Fast and Easy Way to Integrate Manufacturing Effects Into FEA e-Xstream Engineering Dustin Souza
11:15 AM – 11:45 AM A Real Case Study of Cooling CFD Analysis Moldex3D NA Srikar Vallury
11:45 PM – 12:15 PM Introduction to New Interactive Online Injection Molding Training Program Moldex3D NA Jay Vang
12:15 PM – 1:15 PM Lunch
  Hands-on Workshop
1:15 PM – 2:45 PM
  • Quick Demo of Moldex3D
  • Pre-Processing
    – CADdoctor
    – Meshing Best Practices
    – Advantages of Boundary Layer Meshing (BLM)
 Moldex3D NA Jay Vang
2:45 PM – 3:00 PM Break
3:00 PM – 4:30 PM
  • Project Setup
    – Best Practices
    – Standard Simulation Workflow
    – Result Interpretation
  • Studio Demo
 Moldex3D NA Jay Vang
4:30 PM –  Q&A

*Agenda is subject to change.

Venue

Country Inn & Suites by Radisson (California Room)
San Jose International Airport, CA
1350 N 4th St, San Jose, CA 95112, USA

*Reservations must be made at least 2 weeks prior to the event and must be canceled at least 24 hours prior to check-in.

 

 

Contact

Justin Guth
T: 248-946-4570 ext 329
E: justinguth@us.moldex3d.com


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