The Electronic Components and Technology Conference (ECTC) is one of the most prestigious international conferences in the semiconductor packaging industry. Held annually and sponsored by IEEE, ECTC brings together engineers, researchers, and industry leaders to present cutting-edge developments in advanced packaging, materials, and system integration. The conference features peer-reviewed technical papers, panel discussions, and exhibitions showcasing the latest innovations in IC packaging.

We’re proud to share that Moldex3D has been selected to present at ECTC with the paper titled “Advanced Packaging Techniques: Hybrid Numerical and Experimental Analysis of Underfill Flow in Fine Pitch Multi-Chip Modules.” Co-authored by Srikar Vallury, Leo Shen, Ching-Kai Chou, Zi-Hsuan Wei, Wei-Yu Lin, and Yu-En Liang, along with Kazuki Noguchi from Sanyu Rec Co., Ltd., this paper highlights a hybrid simulation and experimental approach to accurately predict underfill flow behavior in fine-pitch multi-chip packaging. The study demonstrates the strength of combining Moldex3D’s advanced simulation capabilities with real-world testing, offering valuable insights for optimizing reliability and performance in advanced packaging applications.

This achievement reflects Moldex3D’s ongoing commitment to innovation and collaboration in the electronics and semiconductor industry.

The paper will also be presented during the conference. We warmly welcome experts and scholars interested in the topic to join us for the presentation and exchange ideas. Please find the presentation schedule below.