2025 Moldex3D IC Packaging Technology International Conference
Date: September 9, 2025
Time: 9:45-16:30 (Check-in starts at 9:15 AM)
Location: WSICC, Hsinchu, Taiwan
With the rapid growth of AI computing, autonomous driving, and increasingly complex systems, advanced packaging has become a cornerstone of next-generation semiconductor innovation. The 2025 Moldex3D IC Packaging Technology International Conference will spotlight cutting-edge advancements in chiplet integration, high-speed interconnects, and heterogeneous design, demonstrating how simulation and Digital Twin technologies are now gaining significant momentum as the next breakthrough in semiconductor technology.
Key Focus Areas:
- Next-Gen Packaging Technologies: Explore advancements in Co-Packaged Optics (CPO), High Bandwidth Memory (HBM), and Fan-Out Panel-Level Packaging (FOPLP) for scalable, high-performance integration.
- CAE-Driven Innovation: Discover how simulation optimizes capillary underfill (CUF), equivalent bump group (EBG), and delamination analysis, while enabling breakthroughs in Nonlinear Warpage Control and Chip-on-Wafer-on-Substrate (CoWoS).
- Material Science & Process Optimization: Delve into the latest developments in Epoxy Molding Compound (EMC) and critical process parameters such as speed, pressure, and temperature control.
The day after this conference wraps up, SEMICON Taiwan 2025 (Sep 10-12, 2025) will be held in Taipei, providing international attendees with a wonderful opportunity to experience two major semiconductor events within the same week during their stay in Taiwan. Themed ‘Breaking Limits: Powering the AI Era’, SEMICON Taiwan 2025 showcases how members of the semiconductor community collaborate to drive the unstoppable wave of AI.
Join us to uncover how simulation enhances yield, performance, and development efficiency, accelerating the future of semiconductor packaging.
Join us to uncover how simulation enhances yield, performance, and development efficiency, accelerating the future of semiconductor packaging.
Agenda
| Time | Topic | Presenter |
| 09:15-09:45 | Registration | |
| 09:45-10:00 | Opening | Moldex3D |
| 10:00-10:40 | Digital Twin for Package Fabrication Process Design and Optimization |
National Cheng Kung University |
| 10:40-11:20 | Legendary Benchmark for Micro-Via Molding Prediction |
ASE Taiwan |
| 11:20-12:00 | 2.5D Package Under-Fill Simulation |
Sanyu Rec Japan |
| 12:00-13:30 | Lunch | |
| 13:30-14:00 | Cutting-Edge Advances in IC Packaging and Electronics Potting Simulation with Moldex3D | Moldex3D |
| 14:00-14:30 | Warpage and Buckling Prediction in Advanced Packaging: A Viscoelastic Simulation Workflow Using Moldex3D with Experimental Correlation |
Texas Instruments |
| 14:30-15:00 | Coffee Break | |
| 15:00-15:30 | Improving the Accuracy of Thermoset Viscosity Model for IC-Packaging |
Saeilo Japan |
| 15:30-16:00 | Flow and Deformation Challenges in Flip-Chip Packaging: Insights from CUF, MUF, and Warpage Simulation |
National Kaohsiung University of Science and Technology |
| 16:00-16:30 | Revolutionizing IC Packaging with AI: NeuroShine’s Journey from Lab to Fab |
National Cheng Kung University |
| 16:30 | Closing |
Venue
WSICC (next to HSR Hsinchu Station, Exit 2)
20 F., No. 168, Sec. 2, Fuxing 3rd Rd., Zhubei City, Hsinchu County 302052, Taiwan (Google Maps)
- – 2-minute walk from HSR Hsinchu Station
- – 1-minute walk from TRA Liujia(六家) Station
Recommended Accommodations
The following are recommended accommodations, please make your own reservation.
| Hotel | Distance to WSICC | Location |
| AJ HOTEL (新竹安捷國際酒店) | Same building | Zhubei City |
| SHERATON Hsinchu Hotel (喜來登大飯店) | 10 minutes by car | Zhubei City |
| HOTEL BONZA (享豪大飯店) | 20 minutes by car | Zhubei City |
| Chiao-Lotus HOTEL (喬蓮大飯店) | 20 minutes by car | Zhubei City |
| SHIN YUAN HOTEL (新苑庭園大飯店) | 25 minutes by car | Hsinchu City |
| Lakeshore HOTEL (煙波大飯店) | 25 minutes by car | Hsinchu City |
| Ambassador HOTEL (國賓大飯店) | 25 minutes by car | Hsinchu City |