The investigation of flow behavior of polymeric melts in the water assisted injection molding

R-Y. Chang, C-T. Huang , W-H. Yang, M-H. Tsai, K-I. Lu, and S-J. Liu

ANTEC

Mold cooling system design in injection molding is of great importance because it is crucial not only to reduce molding cycle time but also to improve part quality. Traditional mold cooling analysis is based on the hybrid finite-difference/ boundary element (FD/BEM) approach...

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Three-dimensional CAE of wire-sweep in microchip encapsulation

Wen-Hsien Yang, David C.Hsu, Venny Yang, Rong-Yeu Chang, Francis Su, and Sheng-Jye Huang

ANTEC

Water assisted injection molding (WAIM) is a pretty new way to fabricate hollow or more complicated parts. Basically, the process of WAIM is similar to gas assisted molding. If it is controlled correctly, WAIM can yield thinner, more uniform part walls. However, to obtain better..

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The warpage simulation with in-mold constraint effect in injection molding

Yi-Hui Peng, David C.Hsu, Venny Yang, and Rong-Yeu Chang

ANTEC

Wire Sweep is a common molding problem encountered in microchip encapsulation. The resin melt flow will exert drag force on wires and hence causes deformation of wires. In this paper, an integrated CAE of wire sweep is proposed to help engineer to evaluate and optimize the...

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Integrated numerical simulation of injection molding using true 3D approach

Wen-Hsien Yang, Allen Peng, Louis Liu, David C.Hsu, and Rong-Yeu Chang

ANTEC

This paper develops a new numerical approach to simulating the mold constraint phenomenon of warpage at the in-mold stage in injection-molded part of complex geometry and improves the accuracy of warpage analysis. Warpage in injection molding is the result of unequal...

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Three-dimensional insert molding simulation in injection molding

Rong-Yeu Chang, Yi-Hui Peng, David C.Hsu and Wen-Hsien Yang

ANTEC

The application of true 3D simulation in the injection molding is becoming popular in the recent years. However, a unified CAE analysis based on solid model for the predictions of molding and warpage of the injection-molded part is seldom reported in the literature due to the numerical...

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Molecular dynamics simulation of nano-scale polymeric rheological properties and extrusion flows

Rong-Yeu Chang, Jenn-Jye Wang

ANTEC

For the recent years, the insert molding in injection molding has been very popular. Insert molding is a more efficient technology to the assembly of discrete parts. It reduces the assembly and labor costs and increases the design flexibility. Its benefits are over the...

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Three-dimensional modeling of mold filling in microelectronics encapsulation process

Rong-Yeu Chang, Wen-Hsien Yang, Sheng-Jye Hwang, and Francis Su

IMPACT

In this paper, a fully three-dimensional (3-D) numerical model is developed to simulate the mold-filling behavior in the plastic encapsulation of microelectronics. The conventional Hele–Shaw approximation is inadequate to analyze such a complex process owing to the 3-D nature...

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The effect of surface tension and contact angle on the filling behavior of flip-chip underfill dispensing process

Yung-Yuan Wang, Huan-Chuang Tseng, Rong-Yeu Chang

ANTEC

This paper develops a true three-dimensional numerical approach to simulating the melt filling and fiber orientation in injection-molded part of complex geometry. An efficient finite volume method is combined with VOF method to solve the melt flow during molding. The fiber...

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Cluster computing in numerical simulation of extrusion flow

Rong-Yeu Chang, Hung-Chang Hsu, Chao-Sheng Ke, and Chih-Chung Hsu

ANTEC

In this work, the capillary flow, which is influenced by the surface tension of encapsulant and the contact angle among encapsulant, bumps and substrate of dispensing process for flip chip underfill would be discussed by the theoretical and numerical analysis. The velocity field...

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Three-dimensional computer-aided mold cooling design for injection molding

Rong-Yeu Chang, Wen-Hsien Yang, David C.Hsu, and Venny Yang

ANTEC

In this research, a parallel finite volume method was developed to simulate non-isothermal non-Newtonian steady flow in a coat-hanger extrusion die on PC clusters. We implemented the algorithm by domain decomposition methods that distribute the computational parts equally...

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Computer simulation of 3D short fiber orientation in injection molding

Wen-Hsien Yang, David C.Hsu and Venny Yang, Rong-Yeu Chang

ANTEC

True three-dimensional (3D) mold-filling technique has been a research hotspot since 90s. Important and interesting 3D phenomena such as inertia, corner effect, splitting flow, as well as fiber orientation can only be captured by the true 3D approach. On the other hand...

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To refine mesh or not to ? an innovative mesh generator for 3D mold filling analysis

Rong-Yeu Chang, Louis Liu, Wen-Hsien Yang, Venny Yang, David C.Hsu

ANTEC

This paper presents a true three-dimensional simulation of the underfill flow in the encapsulation of flip-chips. The SIMPLE-based finite volume method (FVM) is combined with the volume of fluid (VOF) method to solve the two-phase flow field and to track the...

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Three-dimensional CAE analysis of underfill flow of flip-chips

Rong-Yeu Chang, Chi-Chen Hung and Wen-Hsien Yang

ANTEC

A finite volume algorithm for simulating polymer injection-compression molding is presented. The developed numerical model deals with non-isothermal flow of compressible, non-Newtonian fluids in complex 3D geometry. Tait equation with modification of considering...

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Three-dimensional modeling of gas-assisted injection molding

Rong-Yeu Chang and Wen-Hsien Yang

ANTEC

The advantages of three-dimensional (3D) moldfilling analysis over the 2.5D model are twofold: improving the prediction accuracy and avoiding the mid-plane construction. Moreover, 3D analysis is essential in the simulations of GAIM or IC packaging. This paper presents a highly...

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Three-dimensional non-isothermal numerical analysis of multi-layer coextrusion

Rong-Yeu Chang, Chao-Sheng Ke, Wen-Hsien Yang, Wen-Li Yang, and David C.Hsu

ANTEC

Gas-Assisted Injection Molding (GAIM) has gained acceptance in the plastic industry during the last decade. The conventional 2.5D approach is inadequate for analyzing such a complex process due to the 3D flow inherent in the gas penetration process. This paper presents a 3D...

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Three-dimensional numerical analysis of the single screw plasticating extrusion process

Rong-Yeu Chang, Che-Wei Hsu, Wen-Hsien Yang, Wen-Li Yang, and David C.Hsu

ANTEC

This paper presents a three-dimensional finite volume algorithm together with the Lagragian mesh technique for simulating the non-isothermal non-Newtonian stratified flow of two or more polymers in a square channel. From the benchmark calculations, the simulated interface...

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Three-dimensional simulation of injection-compression molding of a compact disc

Rong-Yeu Chang, Wen-Ya Chang, Wen-Hsien Yang, Wen-Li Yang, and David C.Hsu

ANTEC

This paper presents a 3D numerical model to investigate the plasticating phenomena in the single screw extruder. The FVM is adopted to solve the governing equations to obtain the velocity and pressure profiles. The enthalpy formulation for the energy equation and the liquid...

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A novel three-dimensional analysis of polymer injection molding

Rong-Yeu Chang and Wen-Hsien Yang

ANTEC

Super Small Outline Dual Inline Memory Module (SO-DIMM) is widely employed in the design of next generation notebook PC and portable electronic devices. The maximum warpage of the injectionmolded connectors are required to be a low as 0.1mm in order to be compatible with...

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CAE approach to relieve notebook connector air-trap problems

Rong-Yeu Chang, Alice S. Lin, David. Hsu, and Fu-Ming Hsu

ANTEC

Weld line problem is crucial to a Pentium-II connector support part on appearance and mechanical consideration. In this work, a CAE tool is adopted during the product-development in order to detect potential weld line problem of the design. Various design revisions are...

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A novel computer simulation technology for the cooling analysis of complex injection molded parts

Rong-Yeu Chang ,Shin-Hui Huang, Wen-Li Yang, I. Y. Chen, and C. C. Lai

ANTEC

Air trap problem is crucial to notebook connectors that have complicated rib-hole structure and thickness variation. Engineering experience is usually not enough to provide a suitable gate-runner system design for these intricate parts. In this work, various design proposals are...

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A fast approach to automatic runner balance

Kun-Chih Chen, Rong-Yeu Chang, David C.Hsu, Alice S. Lin, Kelly Lu

ANTEC

Cooling analysis has been the biggest obstacle in the simulation of the injection molding process, mostly due to the loss of convergence and enormous computation efforts encountered in the conventional boundary element method (BEM) approach. However, cooling...

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Development of 0.5mm super so dimm connector with computer simulation tools

Shiu-Chun Lin, Jian-Ming Yang, Wen-Li Yang, Rong-Yeu Chang, Li-Shen Chen, and Chun-Shin Huang

ANTEC

Runner balance is one of the most important issues to be addressed for multi-cavity mold in the mold design phase. Poor runner sizing will lead to Christmas tree filling pattern and hence different residence time of plastic melt on each cavity. This leads to excessive packing...

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Improvement of pentium-ii connector support design by CAE tool

Thomas Hsieh, David C.Hsu, Alice S. Lin, Andy G. Day, and Rong-Yeu Chang

ANTEC

In this work the gas-assisted injection molding process in introduced to the manufacture of front cover of a motorcycle headlight in order to replace the traditional metal-made part. Due to the sensitivity of gas flow to the design and process variables, computer-aided engineering...

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Study of the chemorheology of a highly-filled epoxy molding compound

Rong-Yeu Chang ,Yih Lin, Fong-Sheng Lin, Wen-Sheng Yang, Chia-Hsiang Hsu

ANTEC

In this work the course of state in the pvT behavior during the injection molding of a plastic lens is investigated. Tait equation describing the equilibrium pvt behavior of amorphous polymers is extended to non-equilibrium state by considering the cooling effect on the phase transition...

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Minimize part warpage by integrated CAE technology

Rong-Yeu Chang, Yen-Cheng Chen,Chia-Hsiang Hsu ,anf Ming-Hung Tsai

ANTEC

This work is aimed to study the chemorheology of the highly-filled epoxy molding compound (EMC) used for the packaging process of microelectronics. Rheological properties are measured by a parallel-plate viscometer and are combined with kinetics of curing reaction to...

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On the dynamics of air-trap in the encapsulation process of microelectronics package

Rong-Yeu Chang, Wen-Sheng Yang, Eugen Chen , Chris Lin, andChia-Hsiang Hsu

ANTEC

Part warpage or distortion is attributed to the differential shrinkage after it is ejected from the mold cavity. Differential shrinkage is a result of pvt behavior of the plastic material used and the differential cooling across the part thickness due to a poor-designed cooling system. In this...

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Computer-aided gas-assisted injection-molding of the front cover of motorcycle headlight

Rong-Yeu Chang, Shiu-Chun Lin, Kuan-Chih Chen, Chia-Hsiang Hsu, and Ming-Hung Tsai

ANTEC

In this work the mechanism of air-trap in the encapsulation process of a micro-electronics package is explored by experiments and numerical simulation. Computer-aided engineering (CAE) technique is developed to study the coupling non-Newtonian fluid flow, heat transfer...

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On the pvt and thermal shrinkage for the injection molding of a plastic lens

Rong-Yeu Chang, Yung-Chen Hsieh, Chia-Hsiang Hsu

ANTEC

A novel methodology of 3D CAE modeling of capillary underfill of multi-chip packages with a large number of micro bumps is employed in this study. The capillary underfill flow is mainly driven by the surface-tension force based on the contact angle between bumps and substrate...

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