Best of ANTEC 2025: Moldex3D Drives Innovation in Automotive Electronics Potting Processes!
Moldex3D is proud to announce that our research paper presented at ANTEC 2025 and has received the prestigious “Best of ANTEC 2025”!
This study conducted in collaboration with Chao Long Motor Parts Corp., focuses on improving the potting process for automotive electronic components, a critical step in ensuring the waterproof, shockproof, and insulating properties of electronic products.
The study leverages Moldex3D CAE software to conduct a comprehensive simulation and analysis of the potting process for an electronic component used in a jet ski. The research encompasses numerical simulations of the entire epoxy potting process, including resin filling, curing, and post-mold curing. These simulation results were then meticulously compared with experimental data at each stage, revealing a high degree of consistency.
Through numerical simulations, this research successfully identified potential process improvements. The aim is to reduce air traps, minimize warpage induced by chemical and thermal shrinkage during phase transitions, and prevent damage to electronic contacts during processing.
This research not only offers valuable insights for similar electronic encapsulation processes but also highlights Moldex3D’s strong capabilities in tackling complex manufacturing challenges.
Interested in learning how this award-winning paper utilized simulation analysis to enhance potting processes? Leave your information below to receive the complete ANTEC 2025 Best Paper Presentation PPT for free!
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