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AUG. 2014 | Past Issues Share This:
| Top Story |
Moldex3D IC Packaging Integration for Cadence
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| Tips & Tricks |
Leverage Moldex3D Designer BLM to Maximize Meshing Efficiency
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Plastomotive 2014
Aug 19-20, 2014
Injection Moulding & Blow Moulding International Conference 2014
Aug 21-22, 2014
Molding Innovation Technical Symposium at IC3MT 2014
Sep 01, 2014
FOAMS® 2014
Sep 08-11 ,2014
The 14th-annual SPE Automotive Composites Conference & Exhibition (ACCE)
Sep 09-11 ,2014
EMMA Expo India
Sep 11-13 ,2014
Molding Innovation Days 2014: Le Mans, France
Sep 16 ,2014
Moldex3D Half Day Training Series
Sep 04,2014
Moldex3D eDesign 2 Day Training and Certificate
Oct 01-02,2014

CoreTech System Announces Moldex3D R13.0: Best-in-class Industry-oriented Simulation Solutions
Moldex3D Celebrated Grand Opening of a New Moldex3D Office in Bangkok, Thailand
Moldex3D Exhibits at DAC 2014 and Unveils New IC Packaging Simulation Features
Moldex3D Simulates Screw-induced Long Fiber Breakage during the Injection Molding Process
Moldex3D Expands Simulation Capabilities on Core-back Technology Combined with MuCell® Process Technology
Predicting Fiber Breakage with Moldex3D
Using Moldex3D MuCell® Module to Simulate Core-back Technique
Experience Rapid Modeling and Meshing with DesignerBLM
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