Having trouble reading this email? View it in your browser
FEB. 2016 | Past Issues  
Share This : facebook   linkedin   twitter   google+  
  Visualizing Warpage Behavior during Post-mold Cure Stage in IC Packaging Using Advanced CAE Technology
  If the warpage problem is too severe, the internal microstructure of the encapsulated unit might be damaged or malfunctioned. Moldex3D’s post-mold cure analysis provides comprehensive simulation … 

  Kyoto University Successfully Utilized Moldex3D to Validate New MuCell® Process
  Researchers in the Kyoto University have modified foam injection molding experiments with core-back operation. Moldex3D MuCell® helped them to understand the physical phenomena happening throughout the whole foaming process … 

  Moldex3D Announces the Publication of “An Objective Tensor to Predict Anisotropic Fiber Orientation in Concentrated Suspensions” on Journal of Rheology®
  The paper received an outstanding recommendation from the journal’s peer reviewers and was highly recognized for its scholarly merits to further the research study of fiber orientation predictions... 

    Utilize Moldex3D’s Wire Sweep Analysis Result for IC Packaging Process to Avoid a Short Circuit Problem  
    Due to the wire sweep effect during the encapsulation process, the distance between each wire will be shorter and the wires might contact each other. Moldex3D’s feature enables users to analyze the wire sweep effect to avoid a short circuit problem …   
    > READ MORE  
What's New  
CoreTech System Announces the Release of Moldex3D R14.0: The Most Industry-Trusted Software Provider for Plastics Engineering Solutions  
Learning Resources  
Pioneering Simulation Technology for Fiber Concentration Prediction Helps Achieve Your Lightweight Design Concept  
Use Moldex3D’s New Pin Movement Analysis Technology to Yield Greater Process Gains  
Utilizing Moldex3D to Analyze Reynolds Number in Cooling Channels  
Applying Wall Slip Boundary Conditions in Simulation Analysis  
Moldex3D Training and Certificate  
Moldex3D Half Day Training Series- for APA Users  
[Feb 09-11, 2016] Plastec West 2016  
[Feb 12, 2016] Webinar: Visualizing Flow Imbalance in Multi-cavity Systems through Moldex3D R14.0  
[Feb 26, 2016] Webinar: Advanced Flow and Thermal Analysis for Hot Runner Optimization in Moldex3D  
[Mar 08-10, 2016] JEC World 2016  
[Mar 11, 2016] Webinar: Using Moldex3D to Predict and Avoid Sink Mark Issues in Injection Molded Parts  
[Mar 25, 2016] Webinar: Predicting Surface Marks in Plastic Injection Molding  

Don't want to receive emails from us? Unsubscribe
Contact Moldex3D | Visit Moldex3D | Other Locations | Downloads
》CoreTech System (Moldex3D) Co., Ltd.,
8F-2, No.32, Taiyuan St.Chupei City, Hsinchu County 302, Taiwan
》Moldex3D North America Sales & Support Center
27725 Stansbury Blvd., Suite 190,Farmington Hills, MI 48334
Follow Moldex3D on  
Copyright © 2016 Moldex3D. All rights reserved.