Paddle Shift

The paddle is a flat base, belonging to the leadframe, and is used to support chips. If the paddle system sustains non-uniform pressure loading applied by the flow of epoxy molding compound during process, the paddle deforms. This flow-induced phenomenon is called paddle shift. Moldex3D IC Packaging module provides a convenient tool to utilize stress solvers to predict paddle shift, and the results in Moldex3D Project will be displayed directly.

Capabilities

  • Predicts the paddle shift effect due to unbalanced pressure loading from EMC flow
  • Predicts precisely the paddle deform behavior through the dynamic mesh deformation technique simultaneously in accordance with continually deformed geometry (two way FSI)
  • Supports Two-way FSI and one-way FSI
  • Evaluates the viscous drag forces on paddle exerted by the resin melt flow

Features

FSI phenomenon

  • Considers fluid-structure interaction
  • Two-way FSI and one-way FSI are the options which user could choose in paddle shift analysis of Moldex3D

Paddle Deformed Behavior

  • Separate total displacement into x-axis, y-axis, and z-axis
  • Shear Stress and Von Mises Stress are also displayed
  • Support Scale up the paddle deformation

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