Paddle Shift
The paddle is a flat base, belonging to the leadframe, and is used to support chips. If the paddle system sustains non-uniform pressure loading applied by the flow of epoxy molding compound during process, the paddle deforms. This flow-induced phenomenon is called paddle shift. Moldex3D IC Packaging module provides a convenient tool to utilize stress solvers to predict paddle shift, and the results in Moldex3D Project will be displayed directly.
Capabilities
- Predicts the paddle shift effect due to unbalanced pressure loading from EMC flow
- Predicts precisely the paddle deform behavior through the dynamic mesh deformation technique simultaneously in accordance with continually deformed geometry (two way FSI)
- Supports Two-way FSI and one-way FSI
- Evaluates the viscous drag forces on paddle exerted by the resin melt flow
Features
FSI phenomenon
- Considers fluid-structure interaction
- Two-way FSI and one-way FSI are the options which user could choose in paddle shift analysis of Moldex3D
Paddle Deformed Behavior
- Separate total displacement into x-axis, y-axis, and z-axis
- Shear Stress and Von Mises Stress are also displayed
- Support Scale up the paddle deformation