Moldex3D IC Packaging Cure
Using Moldex3D IC Packaging Cure, it means continually in-mold chemical exothermic reaction after the cavity is fully filled. The reactive heat generation is dependent on the mold temperature and the degree of cure. And the viscous heat generation is the dissipation of mechanical energy in a viscous fluid based shear rate.
Capabilities
- In-depth information of melt front advancement, curing rate, curing conversion
- Considering cure-induced (pvTC) and CTE-mismatch
Features
Conversion Prediction
- Degree of curing/crosslinking of the reactive molding compound
- Higher degree of the molding compound will reveal a higher conversion
- Fast-cure material will have a higher conversion value after molding
Reactive Heat Generation
Dissipation of mechanical energy in a viscous fluid based shear rate