on 07/05/2017

On-demand Webinar: Microchip Encapsulation Analysis

The growing global demand for highly sophisticated and ever smaller electronic goods has made Integrated Chip (IC) packaging challenging and critical to system performance . The residual stress and warpage induced by manufacturing processes are critical issues for plastic encapsulated IC packages.

In this webinar, we will present an integrated workflow within Moldex3D to simulate the filling, curing and post mold curing stages. By considering the effects of temperature and chemical reaction to the viscoelasticity of EMC, pvTC of EMC and mismatch CLTE within the package components, the residual stress and warpage after post mold curing can be correctly predicted. In addition, the other application examples of Moldex3D in the MUF, SiP, void prediction, wire sweep and paddle shift will be also presented in the webinar.

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    Also – Don’t miss this upcoming live webinar!

    DATETIMEZONETOPIC
    2021/09/152:30 PM EDTUnderstanding Shear Stress & Shear Rate as a Simulation Output
    2021/09/2210:00 AM CEST / 1:30 PM ISTDigital Twin-driven Smart Manufacturing
    2021/09/2810:00 AM CEST / 4:00 PM CSTStockage et gestion intelligente des données de simulation
    2021/09/2910:00 AM CEST / 1:30 PM ISTImproving Cooling Efficiency with Moldex3D New Cooling Channel Designer
    2021/09/292:30 PM EDTShort Shots – Why They Occur and How to Avoid Them
    2021/09/3010:00 AM CEST / 4:00 PM CSTJumeau numérique de la machine et production intelligente (T0)
    2021/10/1310:00 AM CEST / 1:30 PM ISTAchieving Smart Manufacturing with Machine Characterization
    2021/10/2010:00 AM CEST / 1:30 PM ISTMaterial Characterization, Digital Twin and Material Hub Cloud Service
    2021/10/2710:00 AM CEST / 1:30 PM ISTAdvanced IC Package Simulation in Moldex3D
    2021/11/102:30 PM ESTShrinkage and Warpage, Cause and Solution

     

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