On-demand Webinar: Electronics Manufacturing Simulations – Moldex3D Digital Lunch and Learn
Manufacturing of components used in the electronics industry involves complex processes such as underfill and potting. Challenges faced during such processes often include part quality issues such as voids and warpage. During this session, attendees will learn how to simulate and visualize such potential defects using Moldex3D. A demo on setting up an IC Packaging simulation will also be provided in this session.