Product Portfolio and Features
eDesign Basic | eDesign | Professional | Advanced | |
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Product Package & Mesh Technology |
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True 3D Mesh | ||||
eDesign | ● | ● | ● | ● |
Boundary Layer Mesh, Tetra | ● | ● | ||
Solid (Hexa, Prism, Pyramid, Hybrid) | ● | |||
2.5D Mesh | ||||
Shell | ● | |||
Standard Injection Molding |
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Solver Capabilities | ||||
Simultaneous Filling Analysis (max.) | 1 | 1 | 1 | 3 |
Parallel Processing (PP) | 4 | 4 | 8 | 12 |
Thermoplastic Injection Molding | ● | ● | ● | ● |
Reaction Injection Molding (RIM) | ● | ● | ● | ● |
Simulation Capabililties | ||||
Filling | ● | ● | ● | ● |
Surface Defect Prediction | ● | ● | ● | ● |
Venting Analysis | ● | ● | ● | ● |
Gate Location | ● | ● | ● | ● |
Cold & Hot Runners | ● | ● | ● | ● |
Runner Balancing | ● | ● | ● | ● |
Packing | ● | ● | ● | |
Cooling | ● | ● | ● | |
Transient Mold Cooling or Heating | ● | ● | ● | |
Conformal Cooling | ● | ● | ● | |
3D Coolant CFD | ○ | ● | ● | |
Rapid Temperature Cycling | ● | ● | ● | |
Induction Heating | ● | ● | ● | |
Heating Elements | ● | ● | ● | |
Warpage | ● | ● | ● | |
Insert Molding | ● | ● | ● | |
Multi-shot Sequential Molding | ● | ● | ● | |
Solution Add-on |
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CAD Interoperability | ||||
SYNC | ○ | ○ | ○ | ○ |
Moldex3D CADdoctor | ○ | ○ | ○ | ○ |
Moldex3D Cooling Channel Designer (CCD) | ○ | ○ | ○ | |
Fiber Reinforced Plastics | ||||
Fiber | ○ | ○ | ○ | ○ |
Stress | ○ | ○ | ○ | |
FEA Interface | ○ | ○ | ○ | |
Micromechanics Interface | ○ | ○ | ○ | |
Moldex3D Digimat-RP | ○ | ○ | ○ | |
DOE | ||||
Expert | ○ | ○ | ○ | |
Thermal Management | ||||
Advanced Hot Runner | ○ | ○ | ○ | |
In-Mold Decoration (IMD) | ○ | ○ | ||
Optical | ||||
Optics | ○ | |||
Viscoelasticity (VE) | ○ | ○ | ○ | |
Special Molding Processes | ||||
Powder Injection Molding (PIM) | ○ | ○ | ○ | ○ |
Foam Injection Molding | ○ | ○ | ○ | |
Gas-Assisted Injection Molding (GAIM) | ○ | ○ | ||
Water-Assisted Injection Molding (WAIM) | ○ | ○ | ||
Co-Injection | ○ | ○ | ||
Bi-Injection | ○ | ○ | ||
PU Chemical Foaming | ○ | ○ | ||
Compression Molding (CM) | ○ | |||
Injection Compression Molding (ICM) | ○ | |||
Resin Transfer Molding (RTM) | ○ |
- Moldex3D SYNC supports PTC® Creo®, NX, and SOLIDWORKS ®.
- Moldex3D FEA Interface supports Abaqus, ANSYS, MSC.Nastran, Nastran, NX Nastran, LS-DYNA, MSC.Marc, and Radioss.
- Moldex3D Micromechanics Interface supports Digimat and CONVERSE.
- Database: Thermoplastics materials, thermoset materials, molding materials, coolant materials, and mold materials.
システム要求 (System Requirements)
A. サポートされるプラットフォーム
Platform | OS | Remark |
Windows / x86-64 |
Windows 10 family |
Moldex3D 2020 は、Windows 10プラットフォームを経て認証済み *: Update to KB2919355or newer version required |
Linux / x86-64 |
CentOS 6 family |
Linuxプラットフォームは、計算にのみ使用。ライセンス管理、フロントエンドプロセッサーとバックエンドプロセッサーはLinuxプラットフォームをサポートしません。 |
B. ハードウェア仕様
基本 | |
CPU | Intel® Core i7 Sandy Bridge seriesプロセッサー |
RAM | 16 GB RAM |
HDD | 1 TBの使用可能容量 |
推奨 | |
CPU | Intel® Xeon Platinum 8000 seriesプロセッサー* |
RAM | 64 GB RAM |
HDD | 4 TBの使用可能容量 |
Graphic Card | NVIDIA Quadro series, AMD Radeon series |
Screen Resolution | 1920 x 1080 |
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Intel Xeon E5-1620は推奨される仕様であり、公式benchmark(4x8G RAM)に適用されます。このCPUには4個の最大帯域幅51.2GB/sのメモリチャンネルがあります。各CPUコアのメモリチャンネルあたりの帯域幅は、12.8GB/sです。 http://ark.intel.com/products/64621/Intel-Xeon-Processor-E5-1620-10M-Cache-3_60-GHz-0_0-GTs-Intel-QPI
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注: 計算のパフォーマンスと安定を増加するため、RC/DMP 下のHyper-Threading RC/DMPを閉じるようお勧めします。