International Engineering Fair 2015

  • Date:Sep 14, 2015 - Sep 18, 2015
  • Location: Brno, Czech Republic
  • Booth Number:TBD
  • Official Website:

The MSV – International Engineering Fair – consists of several areas. The largest of which are materials and components for industrial machinery, electronics, automation and measurement technology, sensor technology, measuring devices and robot technology for automation. Due to the ever-growing exhibitors from various countries have it not fair to their status as the largest and most international technology fair in Central Europe doubt.

Like every year Moldex3D will be present, along with our one and only partners from Czech Republic and Slovakia – SimulPlast. Moldex3D and SimulPlast have a long tradition attending this show. We will be very happy to host you there and learn of your needs and problems when designing your part, mold or process. Take this opportunity to learn from the source and improve your design with Moldex3D!

Make sure to be there with us!


Brno, Czech Republic


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