E-learning 2020 – India: Overcoming Sink Mark and Warpage Through Simulation

  • Date:Jun 04, 2020
  • Location: 1:30 PM IST

 

Upcoming Dates

Date Time  
June 4, 2020 1:30 PM IST Closed

 

Overcoming Sink Mark and Warpage Through Simulation

Sink Mark is one of the most common surface quality problem in injection molding. It caused by uneven shrinkage and easily happened in a part that has thickness variation. There are 2 key points could be optimized to eliminate sink mark. The first is part geometry, includes the thickness and rib design. The second is reducing the shrinkage by modifying mold design and process setting. Meanwhile, optimizing in the similar key points can also lead to reducing warpage, though in some cases, material plays the key factor of warpage.

Moldex3D provides predictive capabilities for capturing the sink mark and warpage phenomenon and identifying potential problematic areas before they occur, so corrective action can be immediately applied, such as changing the gate location or gate diameter, adjust the melt temperature and mold temperature, modify the part thickness, etc. Find out how to use Moldex3D in predicting, analyzing, and correcting sink mark and warpage!

Contact

Khaled EL Bchiri
khaled.bchiri@moldex3d.com

Abhishek Tiwari
+91-98331-97831
abhishek.t@moldex3d.com


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