STMicroelectronics Used Moldex3D to Solve Void Issues During Chip Encapsulation Process

in Customer Success on 09/01/2021

Solving the Unbalance Flow, Weld Line and Air Trap Issues at Once

in Customer Success on 08/02/2021

Achieving Lightweight Plastic Parts with Required Structure Strength

in Customer Success on 06/03/2021

Essential Strength Optimization for Fastening Products

in Customer Success on 05/09/2021

Optimize the Evaporation Jig for High-quality Head-up Display Reflector Molding

in Customer Success on 03/05/2021

Solving Warpage Issues through Reverse Warpage Profile

in Customer Success on 02/03/2021

Chemnitz University of Technology’s Investigation of Wall Slip with Moldex3D

in Customer Success on 11/09/2020

The Method to Improve Surface Quality of Automotive Fog Lamp Bezels

in Customer Success on 09/07/2020
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