Special Prize
KOPLA
Solving Warpage Problem through Injection Analysis and Structural Analysis
Problem:
In this project, KOPLA was tasked with reducing the risk of assembly problems on a door module part. The door module part consisted of many mounting holes for assembly purpose. Therefore, the location of the mounting holes was very crucial and required thorough investigation.
Solution:
KOPLA utilized Moldex3D simulation solution to identify the optimum gate location that could lead to good flow pattern and low warpage displacement. After the best gate location was identified, KOPLA output the warpage simulation result to ANSYS using Moldex3D FEA interface to increase the accuracy of the structural analysis.
Benefit:
- Obtained more realistic structural analysis
- Reduced cycle time and improved product quality
Software used: