웨이퍼 실링 결합은 그 종류가 상당히 많고 복잡하기 때문에, 전체 EMC, 웨이퍼, 가이드선 및 가이드선 프레임 등 다양한 부품 사이의 열 전도 차이의 영향을 받으므로, 굴곡 변형은 마이크로 IC 실링 공정에서 가장 일반적으로 발생하는 문제입니다. Moldex3D 웨이퍼 실링 굴곡 분석은 실체(3D) 그리드 분석으로, 충전 유동, 숙성 분석 결과를 통해 온도와 숙성 현상의 수축 데이터를 얻어 굴곡 변형을 예측합니다.
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