Moldex3D IC 패키징 양생 분석은 금형 캐비티 완전 충진 후에 용융 재료가 지속적으로 화학 발열 반응 및 양생을 지속하는 공정입니다. 그 중 반응열은 금형 온도 및 양생 정도가 재료에 대해 발생하게 되는 열 에너지이며, 점성열은 용융 재료가 유동 전단 속도 영향을 거쳐 금형 내에서 발생하는 기계 열 에너지입니다
전환율 예측
점성열의 생성
| Cookie | Duration | Description |
|---|---|---|
| cookielawinfo-checkbox-analytics | 11 months | This cookie is set by GDPR Cookie Consent plugin. The cookie is used to store the user consent for the cookies in the category "Analytics". |
| cookielawinfo-checkbox-functional | 11 months | The cookie is set by GDPR cookie consent to record the user consent for the cookies in the category "Functional". |
| cookielawinfo-checkbox-necessary | 11 months | This cookie is set by GDPR Cookie Consent plugin. The cookies is used to store the user consent for the cookies in the category "Necessary". |
| cookielawinfo-checkbox-others | 11 months | This cookie is set by GDPR Cookie Consent plugin. The cookie is used to store the user consent for the cookies in the category "Other. |
| cookielawinfo-checkbox-performance | 11 months | This cookie is set by GDPR Cookie Consent plugin. The cookie is used to store the user consent for the cookies in the category "Performance". |
| viewed_cookie_policy | 11 months | The cookie is set by the GDPR Cookie Consent plugin and is used to store whether or not user has consented to the use of cookies. It does not store any personal data. |