Perplexed by challenges and uncertainty in the chip encapsulation process?

Look no further! Moldex3D IC Packaging is your lifesaver.

Incomplete filling, internal voids, wire sweep, and paddle shift are common defects in IC package. Predict them in the early stages to reduce manufacturing cost and cycle time!

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Why Moldex3D IC Packaging?

Moldex3D IC Packaging provides thorough 3D solutions that help you analyze the complicated physical phenomena inherent in the encapsulation process.

With Moldex3D IC Packaging, you’ll benefit from:

  • Visualization of the filling and curing processes and other characteristics
  • Package and mold design validation and optimization
  • Simulation-driven design addressing complex fluid-structure interactions
Moldex3D IC Packaging

What Moldex3D IC Packaging can offer?

Moldex3D IC Packaging currently offers comprehensive support for analysis, ranging from basic flow filling and curing process to other advanced manufacturing evaluations.

Molded Underfill Simulation

  • Optimize the gate and runner designs
  • Visualize filling and curing processes
  • Calculate the pressure drop inside the air zone to optimize the air vent design
  • Evaluate the process conditions and material properties

Capillary Underfill Simulation

  • Visualize capillary-force-induced filling behavior with different surface tension and contact angle
  • Evaluate the flow effects due to bump pitch and bump pattern
  • Optimize the dispensing setting for capillary underfill process

Compression Molding

  • Visualize dynamic melt flow front during compression molding process
  • Evaluate warpage, shear stress distribution, and die shift for Fan-out package

Potting

  • Visualize dispenser pass and feeding in a more realistic and detailed way
  • Simulate surface tension induced behaviors such as creeping

Customer Success Story

Solve Void Issues During Chip Encapsulation Process

With Moldex3D IC Packaging, STMicroelectronics was able to find out the root causes of the problems. Therefore, they could act first on revising the design before manufacturing, which helped them save a lot of time and money.
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Challenges

  • Improving the unbalanced flow behavior
  • Reducing weld lines and voids

Moldex3D Solutions Used

  • Moldex3D IC Packaging

Benefits

  • Identifying locations where weld lines tend to appear
  • Downsizing weld line meeting angles
  • Lowering the probability of void formation

Alleviating Void Challenges in Molded Underfill Process by employing Moldex3D

Molded Underfill (MUF) is a specialized material used in semiconductor packaging, and it comes with its own difficulties including voids, precise dispense. Utilizing Moldex3D can predict potential voids’ location and optimize mold design to reduce the cost.
Reference

Challenges

  • Minimize the area that occurs void

Moldex3D Solutions Used

  • Moldex3D IC Packaging

Benefits

  • Anticipate possible molding defects, such as the location of voids

Optimizing Molding Process Design for Enhanced Reliability in Semiconductor IC Packaging

Over recent years, the system-in-package (SiP) mold market has experienced substantial growth, because of its reduced expenses, compact form factor. However, there are some challenging may occur such as incomplete filling, voiding problems. Moldex3D IC Packaging can assist you to observe these defects.
Reference

Challenges

  • Reducing the incomplete filling
  • Improving warpage performances

Moldex3D Solutions Used

  • Moldex3D IC Packaging

Benefits

  • Design optimization can enhance flow balance
  • Lowering voiding problems

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