|
Cool
Moldex3D/Solid-Cool is a
true 3D simulation tool to analyze the mold cooling process.
It allows users to simulate the cooling process for very thick
parts, parts with big thickness changes, complicated geometry
parts, etc.
Based on true 3D technology, Solid-Cool is an efficient tool
to accurately analyze the mold temperature, the efficiency
of cooling channel layout and the required cooling time in
the design phase.
Moldex3D/Solid-Cool is a useful troubleshooting tool to detect
possible mold cooling system defects, such as unbalanced cooling,
hot spots, prolonged cooling time due to poor cooling efficiency.
With true 3D technology, users can accurately evaluate the
solid cooling efficiency to further optimize the cooling system
design and reduce cycle time.
Capabilities
Moldex3D/Solid-Cool allows you to
| |
Predict temperature
within part, runner, cooling channels, inserts, etc |
| |
Evaluate the efficiency of cooling
system design, including cooling circuits, inserts, mold
base, heating rod, etc |
| |
Minimize unbalanced cooling problem |
| |
Determine the required cooling cycle
time |
|
Optimize mold cooling system design
to achieve optimum cooling efficiency with the minimum
cycle time |
|
Use an easy and fast cooling analysis
solution "Mesh-Free Solid-FastCool" to quickly
validate mold cooling system designs. |
|
Simulate multi-component molding process,
including insert molding and multi-shot sequential molding(Moldex3D/Solid-MCM
module is required) |
Features
|