Moldex3D - True 3D CAE for Injection Molding

Leading 3D simulation technology for in-depth design verification and troubleshooting

Moldex3D/Solid is the world's leading true 3D simulation solution for in-depth design verification and troubleshooting With the best-in-class 3D technology based on solid hybrid mesh and High-Performance Finite Volume Method (HPFVM), Moldex3D/Solid allows you to optimize product designs and predict manufacturability.

By using Moldex3D/Solid, users can perform true 3D simulation on the widest range of application, including thick parts, those that have extreme thickness changes from thin to thick, those that are difficult to define a proper midplane model, or those with very complicated part geometry. Users can directly analyze the solid model without having to make significant model simplifications. The explicit analysis capabilities of Moldex3D/Solid provide users deep insight in solid plastic flow behaviors from macro view to micro view, such as fountain flow, inertia effect, gravity effect or shear-induced viscous heating. The intuitive displays help users to evaluate analysis results in three dimension and clearly address design defects.

Moldex3D/Solid has been proven by many users to be the most accurate 3D simulation solution. It is capable of simulating the plastics filling and packing, mold cooling, fiber orientation and part warpage for thermoplastic injection molding. Additional modules simulate multi-component molding (MCM) and reactive injection molding (RIM). Besides, the interface modules (I2) link Moldex3D with the popular structural analysis software to allow you to evaluate the interaction of process-induced material anisotropy and its effects on part structure.

Furthermore, Moldex3D/Solid has been developed with parallel computing technology in mind. With high-performance parallelized computing kernel, users can perform analyses on complex models with much less time than ever.

For conventional single material injection molding, please check

Solid-Flow

Solid-Pack

Solid-Cool

Solid-Warp

Solid-Fiber

For overmolding, two-color injection molding or insert molding, you need the additional module

Solid-MCM

For reactive injection molding and Microchip encapsulation, please check

Solid-RIM

To link your molding CAE results with advanced structural analysis, you need

Solid-I2

To find more about the parallel processing capability of Moldex3D, please check

Parallel Computing

* Microsoft Windows XP Professional, Windows XP x64, or Windows 2000 recommended.
* Intel Pentium, Intel Xeon, Intel EM64T, AMD Athlon, or AMD Opteron based processor.
* 1.0 GB RAM or greater.