Moldex3D IC Packaging Flow

The explicit analysis capabilities of Moldex3D IC Packaging Flow give you deep insight in Epoxy flow behaviors from macro view to micro view, such as fountain flow, and inertia effect. With the power of Moldex3D IC Packaging Flow, you can clearly understand how melt flow progresses, accurately identify where weld surfaces are, and detect short shot problems, etc.

Capabilities

  • Predict Powder Concentration to show the weight percentage and volume fraction of metallic or ceramic particles blended in organic or polymeric binder
  • Predict 3D fountain flow phenomena, inertia phenomena, cavity effects, and viscosity heating effects
  • Predict air traps, voids, and short shots
  • Evaluate the runner layout and type to minimize the volume of material and achieve runner balancing
  • Optimize process conditions in filling stage, such as injection time, melt temperature, ram speed profile, etc
  • Support Venting to improve the flow behavior prediction, especially for cases with trapped gas phenomenon

Features

Defect Prediction

  • Voids location and size captured
  • Short shot range
  • Venting setting for more accurate flow results and optimize process condition to solve air traps

Symmetry model simulation

  • For BC setting only
  • Meshing and Simulation time saving

Powder Concentration Prediction

  • Simulate the particle migration and settling effect
  • Predict the flow mark
 

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