Innovation and Emerging Plastics Technologies Conference 2017


Come Learn from the Plastics Industry Experts!

We’re excited to announce that we will be exhibiting and speaking at this year’s Innovation and Emerging Plastics Technologies Conference, held at Penn State Behrend, June 21-22, 2017. On Jun 22, 2017, our presentation will dive into the latest advances injection molding  simulation technology.

Don’t forget to stop by Moldex3D Booth and get a live demo of our latest product release, Moldex3D R15.0, and talk to our representatives to know more about how Moldex3D can help you gain a competitive edge in plastic part design and manufacturing.

 

Moldex3D Speaking Session

  • Title: Improving Part Quality with the Latest Injection Molding Simulation Technology
  • Date: Thursday, June 22, 2017
  • Time: 9:30 am
  • Location: Session A, Burke 101

As demand for higher quality parts increases, the design of those parts becomes increasingly complex. As such, it becomes more difficult to depend on molding intuition to obtain satisfactory results in a reasonable timeframe. Simulation, in turn, provides the flexibility of obtaining results after multiple iterations of process, material, part design, etc., while reducing the need for trial and error through mold trials. Using this sort of technique, it becomes much more simple and expedient to evaluate the effects of small alterations on complex problems. This presentation will demonstrate how the latest simulation technology can help improve critical product quality criteria, including dimensional stability and physical appearance.

About Innovation and Emerging Plastics Technologies Conference

Penn State Erie, The Behrend College, is again hosting this highly successful conference. Come learn from industry experts. There will be half-hour presentations in the mornings, with three concurrent sessions on injection molding technology, materials technology, and executive/management practices. The afternoons will feature a choice of three-hour tutorials, with many including a hands-on component. A networking session will be held after the tutorials on June 21.


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