M oldex3D will participate in the InterMold Korea 2007 Exhibition from Mar. 21-25, 2007
 
2007.03.02

Moldex3D is pleased to invite you to visit our booth at InterMold Korea 2007. This big event will be held at KINTEX in Ilsan Korea. During the exhibition, our Moldex3D representatives and experts will show you the latest innovation of Moldex3D simulation technology. In the meantime, we will introduce you the latest product of Moldex3D, eDesign, and demonstrate its powerful ability.

At the 17th InterMold Korea, more than 200 companies from 18 countries demonstrated their latest molds, related machine tools, and technologies. The international exposition, InterMold Korea 2007, honoring the industries that have led the growth of Korea's manufacturing sector, will be held from Mar. 21 to 25, 2007.

This year, at InterMold Korea 2007, visitors will all be able to access to the latest information of molds, related machines, designs and high-tech manufacturing processes, both domestic and foreign. Moldex3D and its Korean reseller, ETS-SOFT, look forward to seeing you soon.

Event Profile
Place: KINTEX, Ilsan, Korea
Period: Mar. 21-25, 2007
Moldex3D Booth No.: A63
Official Website: http://www.koreamold.com/newkod3/eng/e_index.asp

If you have any question, please feel free to contact us
+886-3-560-0199
+886-3-560-0198
conference@moldex3d.com
Moldex3D Reseller in Korea, ETS-SOFT
+82-2-3664-3180
+82-2-3664-8474
noh@ets-soft.com 

Moldex3D - True 3D CAE for Injection Molding

Press Release
Newsletter
Tradeshows & Conferences
Seminar & User's Meeting