SEMICON Taiwan 2018


Come visit Moldex3D Booth (#K2466) during SEMICON Taiwan, from 5-7 September 2018 at the Taipei Nangang Exhibition Center, to walk you through Moldex3D’s simulation capabilities. The IC packaging simulation of Moldex3D can address critical molding challenges of IC packaging, such as voids of CUF, MUF or SiP, strip warpage, wire sweep and other issues. We will also be showcasing how Moldex3D using it’s fully 3D IC Packaging module can be used to help optimize part/mold design effectively.

About SEMICON Taiwan
SEMICON Taiwan is the premier event in Taiwan for microelectronics manufacturing. Connect with the companies, people, products and information shaping the future of design and manufacturing for semiconductors, nanoelectronics, MEMS, Photovoltaics and related advanced electronics.

Venue

Taipei Nangang Exhibition Center
(No.1, Jingmao 2nd Rd., Nangang District, Taipei City 11568, Taiwan)

Contact

Anita Chen
anitachen@moldex3d.com
+886-3-5600199 ext. 703


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