- Date:Mar 14, 2018 - Mar 16, 2018
- Location: Shanghai, China
- Booth Number:Hall E7 7227
Our very first time to exhibit at SEMICON China!
Moldex3D has engaged in molding simulation of IC packaging for years; our clients of IC packaging spread all over the world. We keep innovating and researching to develop latest molding technology for fitting the needs of dynamic microelectronics market.
In this exhibition we will showcase :
- Transfer molding and Molded underfill simulation
- Capillary underfill molding simulation
- Post Mold Cure warpage simulation
- Compression molding simulation
Visit Moldex3D at Booth 7227 Hall E7 In Shanghai New International Exhibition Center!
About SEMICON China
SEMICON China connects you to the world’s fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most qualified audience of industry professionals in China.
Contact
Kate Chan
katechan@moldex3d.com
+886-3-5600199 #715